Sputtering Systems
Sputtering is the ideal method to deposit stoichiometric conformal coatings. It is extensively used in the semiconductor and electronics industry. Our systems are ideal for coating a wide range of substrates including silicon, glass and plastics.
Since ESC was founded in 1991, we have built and refurbished a range of thin film deposition systems for many industries around the world. Our extensive, practical, know-how in vacuum systems, and understanding of plasma processes, allows us to deliver systems that have very high availability, deliver repeatable films and are operator friendly.
New Build Standard Systems
Our standard sputtering systems deposit onto 25 2" substrates through to 4 6" substrates, on a 12" platter. They have support for 2-4 cathodes, positions can be blanked as needed.
All the systems have a load lock, either high vac or low vac with the ability to heat or etch as required. Etch is also available in the main chamber. Ion beam milling is an option in place of a sputter target.
"In-process" gases can be delivered into the chamber, or at the cathode. RF or DC sputtering is supported, along with any bias required.
Upgrade Legacy Tools
At our build and test facility in Cambridgeshire, we have upgraded and maintained third-party systems from MRC & KDF to ensure improved performance and an extended life cycle of the machine. Once the machine has an ESC PLC and software set installed, it is guaranteed to support future versions of Windows, and ESC retains the ability to write code so that any new parts like gauges, pumps, or MFCs can be supported. This protects your investment for the future.
Any of the options available on a new tool can be retrofitted to legacy systems, in particular, adding a high vac load lock improves throughput and process repeatability significantly.
